CMS09 TOSHIBA Semiconductor CORPORATION, CMS09 Datasheet - Page 2
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CMS09
Manufacturer Part Number
CMS09
Description
Switching Mode Power Supply Applications Portable Equipment Battery Applications
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.CMS09.pdf
(5 pages)
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Marking
Standard Soldering Pad
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
Abbreviation Code
V
I
I
T
F(AV)
FSM
j
RRM
:
1.4
:
S9
:
:
Use this rating with reference to the above. V
this temperature coefficient into account designing a device at low temperature.
We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of I
using an allowable Tamax-I
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a T
F(AV)
3.0
and T
Part No.
CMS09
j
be below 120°C. When using this device, take the margin into consideration by
j
1.4
of below 120°C.
Unit: mm
F(AV)
curve.
2
RRM
has a temperature coefficient of 0.1%/°C. Take
2006-11-13
CMS09