CMH04 TOSHIBA Semiconductor CORPORATION, CMH04 Datasheet
CMH04
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CMH04 Summary of contents
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... JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. Max ⎯ ⎯ 0.70 ⎯ ⎯ 0.84 ⎯ 0.87 0.98 ⎯ ⎯ 10 ⎯ ⎯ 35 ⎯ ⎯ 100 ⎯ ⎯ 60 ⎯ ⎯ 135 ⎯ ⎯ 210 ⎯ ⎯ 16 2006-11-08 CMH04 Unit: mm Unit V μ °C/W °C/W ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit: mm 1.4 2 CMH04 2006-11-08 ...
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... Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 t Device mounted on a ceramic board: board size × Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 t 0.1 0 Time t (s) 3 CMH04 P – (AV) F (AV) 0.4 0.6 0.8 1.0 1.2 Ta max – (AV) Device mounted on a glass-epoxy board: board size × Soldering land: 6.0 mm × ...
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... C – 100 Ta = 25° MHz Reverse voltage V R (V) (Typ 100 4 CMH04 Surge forward current (non-repetitive 25° 100 Number of cycles 2006-11-08 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMH04 20070701-EN 2006-11-08 ...