TD62304AFG TOSHIBA Semiconductor CORPORATION, TD62304AFG Datasheet

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TD62304AFG

Manufacturer Part Number
TD62304AFG
Description
7ch Low Active Darlington Sink Driver
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
TD62304AFG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
7CH LOW ACTIVE DARLINGTON SINK DRIVER
The TD62304APG/AFG and TD62305APG/AFG are
non−inverting transistor arrays, which are comprised of eight
NPN darlington buffer-transistor output stages and PNP input
stages.
These devices can be operated by source input voltage and are
suitable for operations with a 5-V general purposed logic IC such
as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink
current output drivers.
Please observe the thermal condition for using.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
Pin connection
Schematics
Output current (single output) 500 mA (Max.)
High sustaining voltage
Low level active input
Input compatible with 5-V TTL and 5-V CMOS
Package type- APG: DIP-16 pin
Package type- AFG: SOP-18 pin
TD62304APG/AFG
Note:
The input and output parasitic diodes cannot be used as clamp diodes.
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
(each driver)
(top view)
50 V (Min.)
TD62304APG,TD62304AFG
TD62305APG,TD62305AFG
TD62305APG/AFG
1
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
SOP16-P-225-1.27: 0.16 g (typ.)
TD62304APG
TD62305APG
TD62304AFG
TD62305AFG
TD62304,305/APG/AFG
2006-06-13

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TD62304AFG Summary of contents

Page 1

... Package type- APG: DIP-16 pin Package type- AFG: SOP-18 pin Pin connection (top view) Schematics (each driver) TD62304APG/AFG Note: The input and output parasitic diodes cannot be used as clamp diodes. TD62304,305/APG/AFG TD62304APG TD62305APG TD62304AFG TD62305AFG Weight DIP16-P-300-2.54A: 1.11 g (typ.) SOP16-P-225-1.27: 0.16 g (typ.) TD62305APG/AFG 1 2006-06-13 ...

Page 2

Absolute Maximum Ratings CHARACTERISTICS Supply Voltage Output Sustaining Voltage Output Current Input Voltage Input Current APG Power Dissipation AFG Operating Temperature Storage Temperature Note 1: TD62305APG / AFG Note 2: On glass epoxy PCB (30 × 30 × 1.6 mm ...

Page 3

Recommended Operating Conditions (Ta = −40~85°C and Ta = −30~75°C for only Type−P) CHARACTERISTIC Supply Voltage Output Sustaining Voltage APG Output Current AFG TD62304APG / AFG Input Voltage TD62305APG / AFG APG Power Dissipation AFG Note 1: On glass epoxy ...

Page 4

Test Circuit 1. I CEX (ON (ON OFF Note 1: Pulse Width 50 µs, duty cycle 10% Output impedance 50 Ω, t ≤ Note 2: ...

Page 5

TD62304APG/AFG TD62304APG/AFG TD62304,305/APG/AFG TD62305APG/AFG TD62305APG/AFG ① Type-APG Free Air ② Type-AFG On Glass Epoxy PCB 30×30×1.6mm ③ Type-AFG Free Air 5 2006-06-13 ...

Page 6

Package Dimensions DIP16−P−300−2.54A Weight: 1.11 g (Typ.) TD62304,305/APG/AFG 6 Unit : mm 2006-06-13 ...

Page 7

Package Dimensions SOP16−P−225−1.27 Weight: 0.16 g (Typ.) TD62304,305/APG/AFG 7 Unit : mm 2006-06-13 ...

Page 8

Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...

Page 9

Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...

Page 10

About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use ...

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