TD62382APG TOSHIBA Semiconductor CORPORATION, TD62382APG Datasheet - Page 10
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TD62382APG
Manufacturer Part Number
TD62382APG
Description
8ch Low Input Active Sink Driver
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.TD62382APG.pdf
(10 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TD62382APG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
RESTRICTIONS ON PRODUCT USE
About solderability, following conditions were confirmed
• Solderability
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
• The products described in this document shall not be used or embedded to any downstream products of which
• The information contained herein is presented only as a guide for the applications of our products. No
• The products described in this document are subject to the foreign exchange and foreign trade laws.
(1) Use of Sn-37Pb solder Bath
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
021023_A
021023_C
021023_B
10
021023_D
TD62382APG/AFG
060106_Q
021023_E
2006-06-13
060116EBA