MT9HTF12872FY-667 Micron Semiconductor Products, MT9HTF12872FY-667 Datasheet - Page 2

• Manufacturer Part Number: MT9HTF12872FY-667
• Description: 512mb, 1gb X72, Sr 240-pin Ddr2 Sdram Fbdimm
• Manufacturer: Micron Semiconductor Products

Table 2:
Table 3:
Table 4:
PDF: 09005aef81a2f1eb/Source: 09005aef81a2f20c
HTF9C64_128x72F.fm - Rev. B 9/07 EN
Parameter
Part Number
Part Number
Refresh count
Device bank address
Device page size per bank
Device configuration
Row address
Column address
Module rank address
MT9HTF6472FY-80E__
MT9HTF6472FY-667__
MT9HTF6472FY-53E__
MT9HTF12872FY-80E__
MT9HTF12872FY-667__
MT9HTF12872FY-53E__
Addressing
Part Numbers and Timing Parameters – 512MB
Base device: MT47H64M8,
Part Numbers and Timing Parameters – 1GB
Base device: MT47H128M8,
2
2
Notes:
Module
Density
Module
Density
1. Data sheets for the base devices can be found on Micron’s Web page.
2. All part numbers end with a four-place code (not shown) that designates component, PCB,
512MB
512MB
512MB
1GB
1GB
1GB
and AMB revisions. Consult factory for current revision codes.
Example: MT9HTF12872FY-667E1D4.
Configuration
Configuration
1
1
128 Meg x 72
128 Meg x 72
128 Meg x 72
512Mb DDR2 SDRAM
64 Meg x 72
64 Meg x 72
64 Meg x 72
1Gb DDR2 SDRAM
512MB, 1GB (x72, SR) 240-Pin DDR2 SDRAM FBDIMM
512Mb (64 Meg x 8)
16K (A0–A13)
4 (BA0, BA1)
1K (A0–A9)
512MB
1 (S0#)
1KB
Bandwidth
Bandwidth
8K
2
Module
Module
6.4 GB/s
5.3 GB/s
4.3 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Memory Clock/
Memory Clock/
3.75ns/533 MT/s
3.75ns/533 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
Data Rate
Data Rate
(CL-
(CL-
Clock Cycles
Clock Cycles
1Gb (128 Meg x 8)
Features (continued)
©2005 Micron Technology, Inc. All rights reserved.
16K (A0–A13)
t
t
8 (BA0–BA2)
5-5-5
5-5-5
4-4-4
5-5-5
5-5-5
4-4-4
RCD-
RCD-
1K (A0–A9)
1 (S0#)
1GB
1KB
8K
t
t
RP)
RP)
Link Transfer
Link Transfer
4.8 GT/s
4.0 GT/s
3.2 GT/s
4.8 GT/s
4.0 GT/s
3.2 GT/s
Rate
Rate