STLC4560 STMicroelectronics, STLC4560 Datasheet

STLC4560

Manufacturer Part Number

STLC4560

Description

Single Chip 802.11b/g Wlan Radio

Manufacturer

STMicroelectronics

Datasheet

1.STLC4560.pdf (8 pages)

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Features

■

Applications

■

January 2008

For further information contact your local STMicroelectronics sales office.

Extremely small footprint

Ultra low power consumption

Fully compliant with the IEEE 802.11b and

802.11g WLAN standards

Support for 54, 48, 36, 24, 18, 12, 9, and

6 Mbit/s OFDM, 11 and 5.5 Mbit/s CCK and

legacy 2 and 1 Mbit/s data rates

Single chip 802.11b/g WLAN solution with fully

integrated:

– zero IF (ZIF) transceiver

– voltage controlled oscillator (VCO)

– high-speed A/D and D/A converters

– OFDM and CCK baseband processor

– ARM9 media access controller (MAC)

– Mode selectable SPI or SDIO host interface

– passive components integration

– PA bias control

– flexible integrated power management unit

– glueless FEM interface

Intelligent power control, including 802.11

power save mode

Fully integrated Bluetooth coexistence

Cellular phones

Personal digital assistants (PDA)

Portable computers

Hand-held data transfer devices

Cameras

Computer peripherals

Cable replacement

(up to 48 Mbps)

Rev 1

Single chip 802.11b/g WLAN radio

Description

The STLC4560 is a single chip 802.11b/g WLAN

radio for embedded, low-power and very small

form factor mobile applications. The product

conforms to the IEEE 802.11b and 802.11g

protocols operating in the 2.45 GHz ISM

frequency band supporting OFDM data rates of

54, 48, 36, 24, 18, 12, 9, and 6 Mbit/s as well as

CCK data rates of 11 and 5.5 Mbit/s and legacy

data rates of 2 and 1 Mbit/s.

The STLC4560 is a fully integrated wireless radio

including a ZIF transceiver, RF Synthesizer/VCO,

high-speed data converters, an OFDM/CCK

digital baseband processor, an ARM9-based

MAC and a complete power management unit

with integrated PA bias control. In addition some

passive components are integrated further

reducing the overall reference design cost and

size. An external FEM completes a highly

integrated chip set solution.

Host control is provided by a flexible SPI or SDIO

serial interface. The SPI interface supports a

maximum clock rate of 48 MHz whereas the 4-bit

SDIO supports a maximum clock rate of 25 MHz.

For maximum flexibility, the STLC4560 accepts

system reference clock frequencies of 19.2, 26,

38.4 and 40 MHz. A reference design evaluation

platform of hardware and software is provided to

system integrators to rapidly enable wireless

connectivity to mobile platforms.

LFBGA240 (8.5x8x1.4mm

STLC4560

)

Data Brief

www.st.com

1/8

Related parts for STLC4560

STLC4560 Summary of contents

Page 1

... For further information contact your local STMicroelectronics sales office. Single chip 802.11b/g WLAN radio LFBGA240 (8.5x8x1.4mm Description The STLC4560 is a single chip 802.11b/g WLAN radio for embedded, low-power and very small form factor mobile applications. The product conforms to the IEEE 802.11b and 802.11g protocols operating in the 2 ...

Page 2

... Block diagram FEM: PA, switches, FEM I/F Balun, passives 2/8 STLC4560 Power management unit (PMU) RF ZIF section: RF VCO Rx down converters Tx up converters Baseband baseband filters processor OFDM/CCK modulation High speed data converters Switch control STLC4560 Host SPI I/F CPU MAC ARM9 WEP Bluetooth CXS I/F device ...

Page 3

... STLC4560 2 Electrical characteristics Table 1. Absolute maximum ratings Symbol Parameter V PMU VBATT CC Voltage on any other pin Any GND to GND Table 2. Operating conditions and input power specifications Symbol Parameter Operating temperature T OP range Input supply voltage VBATT supply Average standby mode ...

Page 4

... C, PSM, transmitting 1.9Mbit/s at the application layer VIO input supply determines host CMOS logic levels for: SPI_CSX, SPI_CLK, SPI_DIN, SPI_DOUT, 1.62 HOST_IRQ, LF_XTAL_IN, FREQ, RF_ACTIVE, STATUS, TX_CONF VIO = 1.86 V STLC4560 Typ. Max. Unit 3.6 5.5 V μA 10 μA 120 μA 610 195 ...

Page 5

... STLC4560 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ...

Page 6

... MAX. MIN. TYP. MAX. 1.4 0.055 0.006 1.065 0.042 0.28 0.011 0.8 0.031 0.3 0.35 0.010 0.012 0.014 8.5 8.65 0.329 0.335 0.341 7.5 0.295 8 8.15 0.309 0.315 0.321 7 0.276 0.5 0.020 0.5 0.020 0.08 0.003 0.15 0.006 0.05 0.002 OUTLINE AND MECHANICAL DATA Body: 8 1.4mm LFBGA240 Low Profile Ball Grid Array 7870466 A STLC4560 ...

Page 7

... STLC4560 4 Ordering information Table 3. Ordering information Order codes STLC4560TRAY STLC4560 5 Revision history Table 4. Document revision history Date 09-Jan-2008 Operating temperature range -30°C to 85°C LFBGA240- (8.5x8x1.4mm) -30°C to 85°C LFBGA240- (8.5x8x1.4mm) Revision 1 Initial release. Ordering information Package Packing Tray Tape and reel ...

Page 8

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com STLC4560 ...

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