STLC4560 STMicroelectronics, STLC4560 Datasheet - Page 5
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STLC4560
Manufacturer Part Number
STLC4560
Description
Single Chip 802.11b/g Wlan Radio
Manufacturer
STMicroelectronics
Datasheet
1.STLC4560.pdf
(8 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
STLC4560
3
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Package mechanical data
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