DSPIC30F2012 Microchip Technology Inc., DSPIC30F2012 Datasheet - Page 191

• Manufacturer Part Number: DSPIC30F2012
• Description: Dspic30f2011/2012/3012/3013 High-performance Digital Signal Controllers
• Manufacturer: Microchip Technology Inc.

28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body [QFN-S]
With 0.40 mm Contact Length
© 2006 Microchip Technology Inc.
Note:
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
dsPIC30F2011/2012/3012/3013
N
Dimension Limits
A1
2
1
EXPOSED
E
A
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
NOTE 1
Units
PAD
A1
A3
E2
D2
E2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.30
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
6.00 BSC
6.00 BSC
0.20 REF
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
—
D2
MAX
1.00
0.05
4.70
4.70
0.43
0.50
—
L
DS70139E-page 189
b
e
K