DSPIC30F2012 Microchip Technology Inc., DSPIC30F2012 Datasheet - Page 192

• Manufacturer Part Number: DSPIC30F2012
• Description: Dspic30f2011/2012/3012/3013 High-performance Digital Signal Controllers
• Manufacturer: Microchip Technology Inc.

dsPIC30F2011/2012/3012/3013
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]
DS70139E-page 190
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
A1
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
Dimension Limits
2
1
E
EXPOSED
A
NOTE 1
PAD
Units
E2
A1
A3
E2
D2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
NOM
0.90
0.02
6.45
6.45
0.30
0.40
D2
44
—
© 2006 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
—
e
b
K