DSPIC33FJ64GP306 Microchip Technology Inc., DSPIC33FJ64GP306 Datasheet - Page 310
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DSPIC33FJ64GP306
Manufacturer Part Number
DSPIC33FJ64GP306
Description
High-performance, 16-bit Digital Signal Controllers
Manufacturer
Microchip Technology Inc.
Datasheet
1.DSPIC33FJ64GP306.pdf
(324 pages)
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dsPIC33FJXXXGPX06/X08/X10
DS70286A-page 306
100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
b
e
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 23
D
D1
Dimension Limits
E1
L
NOTE 2
Units
A2
A1
E1
D1
L1
N
D
e
A
L
E
b
c
E
A
A1
0.95
0.05
0.45
0.09
0.13
MIN
11°
11°
0°
–
L1
MILLIMETERS
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.40 BSC
1.00 REF
NOM
1.00
0.60
0.18
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-100B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.23
13°
13°
7°
A2
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