BUK127-50GT NXP Semiconductors, BUK127-50GT Datasheet
BUK127-50GT
Related parts for BUK127-50GT
BUK127-50GT Summary of contents
Page 1
... D T Continuous junction temperature j R Drain-source on-state resistance DS(ON) FUNCTIONAL BLOCK DIAGRAM INPUT LOGIC AND PROTECTION Fig.1. Elements of the TOPFET. PIN CONFIGURATION Product specification BUK127-50GT MAX. UNIT 50 V 2.1 A 1.8 W 150 ˚C 200 mΩ DRAIN CLAMP POWER MOSFET RIG SOURCE ...
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... D(TO) inductive load ≤ 125 ˚ 250 Hz REQUIRED CONDITION ≥ CONDITIONS Mounted on any PCB Mounted on PCB of fig Product specification BUK127-50GT MAX. UNIT 50 V current trip A 2 1.8 W 150 ˚C 150 ˚C MIN. MAX. ...
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... < IS1 IS2 CONDITIONS 5 25˚C j -40˚C ≤ T ≤ 150˚ 5 Product specification BUK127-50GT MIN. TYP. MAX 100 = 25 ˚ 380 = 25 ˚C - 150 200 mb MIN. ...
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... CONDITIONS ≤ 25 ˚ 25˚C unless otherwise specified mb CONDITIONS = 300 µ not applicable 4 Product specification BUK127-50GT MIN. TYP. MAX. UNIT µs - 0.5 0.9 µs - 0.7 1.5 µs - 3.2 6.5 µs - 1.6 3.5 MIN. MAX. UNIT - 2 A MIN. ...
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... scale 0.32 6.7 3.7 7.3 1.1 0.95 4.6 2.3 0.22 6.3 3.3 6.7 0.7 0.85 REFERENCES JEDEC EIAJ SC-73 Fig.2. SOT223 surface mounting package 5 Product specification BUK127-50GT SOT223 detail 0.2 0.1 0.1 EUROPEAN ISSUE DATE PROJECTION 97-02-28 99-09- Rev 2.000 ...
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... Fig.3. Soldering pattern for surface mounting. December 2001 PRINTED CIRCUIT BOARD Dimensions in mm. 60 6.3 Fig.4. PCB for thermal resistance and power rating. PCB: FR4 epoxy glass (1.6 mm thick), 6 Product specification BUK127-50GT Dimensions in mm 4.5 4 copper laminate (35 µm thick). Rev 2.000 ...
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... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 7 Product specification BUK127-50GT Rev 2.000 ...