NE85001 Renesas Electronics Corporation., NE85001 Datasheet - Page 5

• Manufacturer Part Number: NE85001
• Description: 1 W C-band Power Gaas Fet N-channel Gaas Mes Fet
• Manufacturer: Renesas Electronics Corporation.

CHIP HANDLING
DIE ATTACHMENT
attach is not recommended.
BONDING
less in diameter.
kept within a 280 ˚C _ 5 minute curve. If longer periods are required, the temperature should be lowered.
PRECAUTIONS
environment.
grounded at all times. In fact, all test and handling equipment should be grounded to minimize the possibilities of static
discharge.
Die attach can be accomplished with a Au-Sn (300 10 ˚C) performs in a forming gas environment. Epoxy die
Gate and drain bonding wires should be minimum length, semi-hard gold wire (3 - 8 % elongation) 30 microns or
Bonding should be performed with a wedge tip that has a taper of approximately 15 %.
Die attach and bonding time should be kept to a minimum. As a general rule, the bonding operation should be
The user must operate in a clean, dry environment.
The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean
The bonding equipment should be periodically checked for sources of surge voltage and should be properly
NE85001 SERIES
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