FMA3007 RF Micro Devices, FMA3007 Datasheet - Page 8

• Manufacturer Part Number: FMA3007
• Description: 2 To 20ghz Broadband Mmic Amplifier Fma3007
• Manufacturer: RF Micro Devices

P
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The recommended die attach is gold/tin
eutectic solder under a nitrogen atmosphere.
Stage temperature should be 280-290°C;
maximum time at temperature is one minute.
The recommended wire bond method is
thermo-compression wedge bonding with 0.7
or 1.0 mil (0.018 or 0.025 mm) gold wire.
Stage temperature should be 250-260°C.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
H
P
To avoid damage to the devices care should
be
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing.
devices should be treated as Class 0 (0-250 V)
as defined in JEDEC Standard No. 22-A114.
Further information on ESD control measures
can be found in MIL-STD-1686 and MIL-
HDBK-263.
A
Application Notes and design data including S-
parameters, noise data are available on
request.
D
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
Tel: [phone]
REFERRED
RECAUTIONS
PPLICATION
ANDLING
ISCLAIMERS
exercised
A
:
N
:
SSEMBLY
OTES
during
& D
handling.
I
NSTRUCTIONS
Fax: [phone]
ESIGN
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
D
ATA
Proper
These
:
:
8
Email:
O
RDERING
P
ART
[e-mail]
FMA3007
N
UMBER
I
NFORMATION
Website:
(Gel-pak available on request)
:
D
Die in Waffle-pack
FMA3007
ESCRIPTION
Production Datasheet v3.0
www.filtronic.com