BF621 NXP Semiconductors, BF621 Datasheet - Page 5

• Manufacturer Part Number: BF621
• Description: Pnp High-voltage Transistors
• Manufacturer: NXP Semiconductors

Philips Semiconductors
THERMAL CHARACTERISTICS
Notes
1. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.
2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm
3. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm
2004 Dec 14
R
R
th(j-a)
th(j-s)
PNP high-voltage transistors
Mounted on FR4 printed-circuit board; standard footprint.
(1)
(2)
SYMBOL
(K/W)
Z
th
10
10
10
= 1.
= 0.75.
1
3
2
10
(10)
5
(1)
(3)
(5)
(6)
(7)
(8)
(9)
(2)
(4)
thermal resistance from junction to
ambient
thermal resistance from junction to
soldering point
(3)
(4)
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
10
4
= 0.5.
= 0.33.
PARAMETER
10
(5)
(6)
3
= 0.2.
= 0.1.
10
2
(7)
(8)
= 0.05.
= 0.02.
10
5
in free air
1
note 1
note 2
note 3
CONDITIONS
(9)
(10) = 0.
1
= 0.01.
10
VALUE
BF621; BF623
250
156
113
10
30
2
Product specification
t
p
006aaa235
(s)
10
UNIT
3
K/W
K/W
K/W
K/W
2
2
.
.