ACS8509 Semtech Corporation, ACS8509 Datasheet - Page 63

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ACS8509

Manufacturer Part Number
ACS8509
Description
Synchronous Equipment Timing Source for Sonet or SDH Network Elements
Manufacturer
Semtech Corporation
Datasheet
ACS8509 SETS
ADVANCED COMMUNICATIONS
FINAL
DATASHEET
Thermal Conditions
The device is rated for full temperature range when this package is used with a 4 layer or more PCB. Copper coverage
must exceed 50%. All pins must be soldered to the PCB. Maximum operating temperature must be reduced when the
device is used with a PCB with less than these requirements.
Figure 25 Typical 100 Pin LQFP Footprint
Width = 0.3 mm
Pitch = 0.5 mm
1.85 mm
F8509D_004QFNFootprint100_01
Notes: (i) (1) Solderable to this limit.
(ii) Square package - dimensions apply in both X and Y directions.
(iii) Typical example. The user is responsible for ensuring compatibility with PCB manufacturing process, etc.
Revision 2.00/January 2006 © Semtech Corp.
Page 63
www.semtech.com

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