MD16R1624DF0 Samsung Semiconductor, Inc., MD16R1624DF0 Datasheet - Page 14

• Manufacturer Part Number: MD16R1624DF0
• Description: Description = MD16R1624(8/G)DF0, MD18R1624(8/G)DF0 (16Mx16)*4(8/16)pcs RIMM(TM) Module Based on 256Mb D-die, 32s Banks,16K/32ms Ref, 2.5V ;; Density(MB) = 128 ;; Organization = 32Mx32 ;; Component Composition = 256M(5th)x4 ;; Voltage(V) = 2.5 ;; Refr
• Manufacturer: Samsung Semiconductor, Inc.

MD16R1624(8/G)DF0 - CN1 for 1200MHz
MD18R1624(8/G)DF0 - CN1 for 1200MHz
Physical Dimensions -2 ( For Heat Spreader )
The following defines the 2 channel RDRAM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of
WARNING ! HOT SURFACE
DIA 2.36 0.05[0.09 0.001]
SECTION A-A
WARNING ! HOT SURFACE
Heat Spreader
Thermal
Conductive
Gap Filling
Material
[ Single side module ]
12.7 0.07[0.5 0.002]
Figure 4: Heat Spreader Physical Dimensions
132.76 0.25[5.226 0.009]
127.66 0.12[5.023 0.005]
112.7 0.12[4.436 0.005]
Max 4.70
[0.050 0.004]
Center-Point
CSP
[0.185]
PCB
1.27 0.10
12.7 0.07[0.5 0.002]
133.35 0.127[5.250 0.005]
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A
A
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0.127[ 0.005].
SECTION A-A
http://www.samsungsemi.com
[ Double side module ]
Version 1.0 January 2003
32 Bit RIMM
[0.050 0.004]
Heat Spreader
1.27 0.10
CSP
PCB
Max 7.80
Thermal
Conductive
Gap Filling
Material
[0.307]
®
Module
[0.04 0.002]
2.9
1.00 0.07
[0.114]