MCIMX25 Motorola Semiconductor Products, MCIMX25 Datasheet - Page 122

• Manufacturer Part Number: MCIMX25
• Manufacturer: Motorola Semiconductor Products

4.2
Figure 96
122
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Contact Name
NVCC_CRM
NGND_ADC
MPLL_GND
NVCC_ADC
FUSE_VDD
MPLL_VDD
BATT_VDD
Maximum solder bump diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
Parallelism measurement shall exclude any effect of mark on top surface of package.
Ground, Power, Sense, and Reference Contact Assignments
shows ground, power, sense, and reference contact assignments.
Table 96. Ground, Power Sense, and Reference Contact Assignments
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 2
P10
T17
U17
U18
Y13
W13
N14
Figure 98.
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i.MX25 Production Package
Contact Assignment
Freescale Semiconductor