MCIMX25 Motorola Semiconductor Products, MCIMX25 Datasheet - Page 16

• Manufacturer Part Number: MCIMX25
• Manufacturer: Motorola Semiconductor Products

Figure 2
powered up. After Core VDD and NVDDx are stable, the analog supplies can be powered up.
3.2.2
There are no special requirements for the power-down sequence. All power supplies can be shut down at
the same time.
3.3
The thermal resistance characteristics for the device are given in
under the following conditions:
16
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to boards
QVDD and NVDD
Analog Supplies
•
•
•
•
•
•
•
•
Two-layer substrate
Substrate solder mask thickness: 0.025 mm
Substrate metal thicknesses: 0.016 mm
Substrate core thickness: 0.200 mm
Core via I.D: 0.118 mm, Core via plating 0.016 mm.
Flag: Trace style with ground balls under the die connected to the flag
Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
Mold compound: Generic mold compound; k = 0.9 W/m K
shows the power-up sequence diagram. After POR_B is asserted, Core VDD and NVDDx can be
Thermal Characteristics
POR_B
Power-Down Sequence
2
1
1
1
1
natural convection
natural convection
(@200 ft/min)
(@200 ft/min)
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 2
Rating
Figure 2. Power-Up Sequence Diagram
Table 12. Thermal Resistance Data
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Condition
—
Table
12. These values were measured
Symbol
R
R
R
R
R
eJMA
eJMA
eJA
eJA
eJB
Freescale Semiconductor
Value
55
33
46
29
22
°C/W
°C/W
°C/W
°C/W
°C/W
Unit