TEA1750 NXP Semiconductors, TEA1750 Datasheet - Page 26

• Manufacturer Part Number: TEA1750
• Description: GreenChip III SMPS control IC
• Manufacturer: NXP Semiconductors

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NXP Semiconductors
12. Package outline
Fig 15. Package outline SOT109-1 (SO16)
TEA1750_2
Product data sheet
SO16: plastic small outline package; 16 leads; body width 3.9 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT109-1
0.069
max.
1.75
A
16
1
0.010
0.004
Z
0.25
0.10
pin 1 index
A
1
y
0.057
0.049
1.45
1.25
A
2
076E07
IEC
0.25
0.01
A
3
e
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
REFERENCES
Rev. 02 — 15 December 2008
10.0
0.39
0.38
D
9.8
0
(1)
0.16
0.15
E
4.0
3.8
(1)
b
JEITA
scale
p
2.5
1.27
0.05
9
8
e
w
0.244
0.228
H
6.2
5.8
M
c
E
5 mm
0.041
A
1.05
2
L
A
1
0.039
0.016
1.0
0.4
L
p
0.028
0.020
H
0.7
0.6
E
Q
E
detail X
GreenChip III SMPS control IC
PROJECTION
EUROPEAN
0.25
0.01
L
v
L
p
Q
0.25
0.01
(A )
w
3
A
0.004
TEA1750
0.1
© NXP B.V. 2008. All rights reserved.
y
A
ISSUE DATE
X
v
99-12-27
03-02-19
M
0.028
0.012
Z
0.7
0.3
(1)
A
SOT109-1
8
0
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