PIC16C926-I/CL Microchip Technology, PIC16C926-I/CL Datasheet - Page 102
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PIC16C926-I/CL
Manufacturer Part Number
PIC16C926-I/CL
Description
64/68-Pin CMOS Microcontrollers with LCD Driver
Manufacturer
Microchip Technology
Datasheet
1.PIC16C926-ICL.pdf
(182 pages)
- Current page: 102 of 182
- Download datasheet (4Mb)
PIC16C925/926
12.2.3
Either a prepackaged oscillator can be used, or a sim-
ple oscillator circuit with TTL gates can be built. Pre-
packaged oscillators provide a wide operating range
and better stability. A well designed crystal oscillator
will provide good performance with TTL gates. Two
types of crystal oscillator circuits can be used: one with
series resonance, or one with parallel resonance.
Figure 12-3 shows implementation of a parallel reso-
nant oscillator circuit. The circuit is designed to use the
fundamental frequency of the crystal. The 74AS04
inverter performs the 180-degree phase shift that a par-
allel oscillator requires. The 4.7 k
the negative feedback for stability. The 10 k
ometer biases the 74AS04 in the linear region. This
could be used for external oscillator designs.
FIGURE 12-3:
Figure 12-4 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental fre-
quency of the crystal. The inverter performs a
180-degree phase shift in a series resonant oscillator
circuit. The 330 k resistors provide the negative feed-
back to bias the inverters in their linear region.
FIGURE 12-4:
DS39544A-page 100
74AS04
330 k
10k
+5V
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
0.1 F
20 pF
XTAL
10k
74AS04
XTAL
4.7k
74AS04
330 k
EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
20 pF
EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
10k
74AS04
74AS04
To Other
Devices
resistor provides
To Other
Devices
PIC16CXXX
PIC16CXXX
CLKIN
CLKIN
potenti-
Preliminary
12.2.4
For timing insensitive applications, the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (R
ing temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
C
variation due to tolerance of external R and C compo-
nents used. Figure 12-5 shows how the R/C combina-
tion is connected to the PIC16CXXX. For R
below 2.2 k , the oscillator operation may become
unstable, or stop completely. For very high R
(e.g. 1 M ), the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend to keep
R
Although the oscillator will operate with no external
capacitor (C
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance, or pack-
age lead frame capacitance.
See characterization data for desired device for RC fre-
quency variation from part to part, due to normal pro-
cess variation. The variation is larger for larger R (since
leakage current variation will affect RC frequency more
for large R) and for smaller C (since variation of input
capacitance will affect RC frequency more).
See characterization data for desired device for varia-
tion of oscillator frequency, due to V
R
to operating temperature for given R, C, and V
values.
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test pur-
poses or to synchronize other logic (see Figure 1-2 for
waveform).
FIGURE 12-5:
EXT
EXT
EXT
C
R
V
EXT
SS
EXT
/C
EXT
values. The user also needs to take into account
between 3 k and 100 k .
V
DD
EXT
) and capacitor (C
values, as well as frequency variation due
RC OSCILLATOR
EXT
F
OSC
= 0 pF), we recommend using values
/4
RC OSCILLATOR MODE
OSC1
OSC2/CLKOUT
2001 Microchip Technology Inc.
EXT
) values, and the operat-
DD
PIC16CXXX
Internal
EXT
EXT
Clock
for given
values
values
DD
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