SSTUH32866 Philips Semiconductors, SSTUH32866 Datasheet - Page 2

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SSTUH32866

Manufacturer Part Number
SSTUH32866
Description
1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer
Manufacturer
Philips Semiconductors
Datasheet
Philips Semiconductors
3. Applications
4. Ordering information
Table 1:
T
9397 750 14199
Product data sheet
Type number
SSTUH32866EC/G
SSTUH32866EC
amb
= 0 C to +70 C.
Ordering information
Solder process
Pb-free (SnAgCu
solder ball compound)
SnPb solder ball
compound
Supports LVCMOS switching levels on the control and RESET inputs
Single 1.8 V supply operation
Available in 96-ball, 13.5 mm
DDR2 registered DIMMs desiring parity checking functionality
Stacked or planar high-DRAM count registered DIMMs
Package
Name
LFBGA96
LFBGA96
1.8 V high-drive DDR2 configurable registered buffer with parity
Rev. 01 — 13 May 2005
Description
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
5.5 mm, 0.8 mm ball pitch LFBGA package
5.5
5.5
1.05 mm
1.05 mm
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTUH32866
www.DataSheet4U.com
Version
SOT536-1
SOT536-1
2 of 28

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