IDT7282L20PA8 IDT, Integrated Device Technology Inc, IDT7282L20PA8 Datasheet - Page 7

IC FIFO 1KX9 20NS 56TSSOP

IDT7282L20PA8

Manufacturer Part Number
IDT7282L20PA8
Description
IC FIFO 1KX9 20NS 56TSSOP
Manufacturer
IDT, Integrated Device Technology Inc
Series
7200r
Datasheet

Specifications of IDT7282L20PA8

Function
Asynchronous
Memory Size
9K (1K x 9)
Access Time
20ns
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
56-TSSOP
Configuration
Dual
Density
9Kb
Access Time (max)
20ns
Word Size
9b
Organization
1Kx9
Sync/async
Asynchronous
Expandable
Yes
Bus Direction
Uni-Directional
Package Type
TSSOP
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Supply Current
125mA
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
56
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Data Rate
-
Lead Free Status / Rohs Status
Not Compliant
Other names
7282L20PA8

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT7282L20PA8
Manufacturer:
TSC
Quantity:
4 000
OPERATING MODES:
each system (i.e. FF is monitored on the device where W is used; EF is monitored
on the device where R is used).
SINGLE DEVICE MODE
application requirements are for 256/512/1,024/2,048/4,096/8,192 words or
less. These FIFOs are in a Single Device Configuration when the Expansion
In (XI) control input is grounded (see Figure 12).
DEPTH EXPANSION
ments are for greater than 256/512/1,024/2,048/4,096/8,192 words. Figure
HF
XO
IDT7280/7281/7282/7283/7284/7285 5V ASYNCHRONOUS FIFO
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9
R
W
XI
W
W
R
R
Care must be taken to assure that the appropriate flag is monitored by
A single IDT7280/7281/7282/7283/7284/7285 may be used when the
These devices can easily be adapted to applications when the require-
t
HALF-FULL OR LESS
LAST PHYSICAL
XIS
LOCATION
WRITE TO
t
XOL
t
XI
FIRST PHYSICAL
LOCATION
WRITE TO
t
WHF
t
XOH
Figure 9. Half-Full Flag Timing
Figure 10. Expansion Out
t
XIR
Figure 11. Expansion In
MORE THAN HALF-FULL
7
14 demonstrates a four-FIFO Depth Expansion using two IDT7280/7281/
7282/7283/7284/7285s. Any depth can be attained by adding additional
IDT7280/7281/7282/7283/7284/7285s. These FIFOs operate in the Depth
Expansion mode when the following conditions are met:
1. The first FIFO must be designated by grounding the First Load (FL) control
2. All other FIFOs must have FL in the HIGH state.
3. The Expansion Out (XO) pin of each device must be tied to the Expansion
4. External logic is needed to generate a composite Full Flag (FF) and Empty
5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in
input.
In (XI) pin of the next device. See Figure 14.
Flag (EF). This requires the ORing of all EFs and ORing of all FFs (i.e. all
must be set to generate the correct composite FF or EF). See Figure 14.
the Depth Expansion Mode.
t
LAST PHYSICAL
XIS
READ FROM
LOCATION
t
XOL
FIRST PHYSICAL
READ FROM
LOCATION
t
RHF
COMMERCIAL TEMPERATURE RANGE
t
XOH
HALF-FULL OR LESS
JANUARY 13, 2009
3208 drw 11
3208 drw 12
3208 drw 13

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