RF3163 RF Micro Devices, RF3163 Datasheet - Page 7

• Manufacturer Part Number: RF3163
• Description: 3V 900MHZ LINEAR POWER AMPLIFIER MODULE
• Manufacturer: RF Micro Devices

PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is
3µinch to 8µinch gold over 180µinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
Rev A0 040730
Figure 1. PCB Metal Land Pattern (Top View)
0.50 Typ.
0.55 Typ.
PCB Design Requirements
0.55 Typ.
Pin 1
0.50 Typ.
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 0.64 x 1.28 (mm)
D = 1.50 (mm) Sq.
Pin 16
A
A
A
A
B
B
1.50 Typ.
B
B
D
0.75 Typ.
B
B
B
B
Pin 8
Dimensions in mm.
A
C
Pin 12
0.75 Typ.
1.00 Typ.
RF3163
2-695