RF3163 RF Micro Devices, RF3163 Datasheet - Page 8

• Manufacturer Part Number: RF3163
• Description: 3V 900MHZ LINEAR POWER AMPLIFIER MODULE
• Manufacturer: RF Micro Devices

PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the
device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating
routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
2-696
Figure 2. PCB Solder Mask Pattern (Top View)
RF3163
0.50 Typ.
0.55 Typ.
0.55 Typ.
Pin 1
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 1.60 (mm) Sq.
0.50 Typ.
Pin 16
A
A
A
A
B
B
1.50 Typ.
B
B
C
0.75
B
B
B
B
Pin 8
Dimensions in mm.
A
A
A
A
Pin 12
0.75
1.50 Typ.
Rev A0 040730