UPD77015GC NEC, UPD77015GC Datasheet - Page 55

• Manufacturer Part Number: UPD77015GC
• Description: 16 bits/ Fixed-point Digital Signal Processor
• Manufacturer: NEC

I
Vapor Phase Soldering
Partial heating method
PD77017GC-
PD77018GC-
nfrared ray reflow
Note
Caution
Process
Maximum allowable time from taking the soldering package out of dry pack to soldering.
Storage conditions: 25 C and relative humidity of 65 % or less.
Apply only one kind of soldering condition to a device, except for “partial heating method”,
or the device will be damaged by heat stress.
-9EU: 100-pin plastic TQFP (FINE PITCH) (14mm
-9EU: 100-pin plastic TQFP (FINE PITCH) (14mm
Peak temperature: 235 ˚C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 ˚C or higher),
Maximum number of reflow processes : 2 times,
Exposure limit
afterwards).
Peak temperature: 215 ˚C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 ˚C or higher),
Maximum number of reflow processes : 2 times,
Exposure limit
afterwards).
Pin temperature : 300 ˚C or below,
Heat time : 3 seconds or less (Per each side of the device)
Note
Note
: 3 days (10 hours pre-baking is required at 125 ˚C
: 3 days (10 hours pre-baking is required at 125 C
Conditions
14mm)
14mm)
PD77015, 77017, 77018
IR35-103-2
VP15-103-2
Symbol
55