DS26334 Dallas Semiconductor, DS26334 Datasheet - Page 118

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DS26334

Manufacturer Part Number
DS26334
Description
E1/T1/J1 Shortand Long-Haul Line Interface Unit
Manufacturer
Dallas Semiconductor
Datasheet

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12 THERMAL INFORMATION
Table 12-1. Thermal Characteristics
Table 12-2. Package Power Dissipation (for Thermal Considerations)
Ambient Temperature
Junction Temperature
Theta-JA (θ
Theta-JC (θ
Theta-JB (θ
Theta-JA (θ
Theta-JA (θ
Theta-JA (θ
Note 1:
Note 2:
Note 1:
Note 2:
Note 3:
E1-120Ω
T1-LBO0
T1-LBO1
T1-LBO2
T1-LBO3
T1-LBO4
J1-LBO0
J1-LBO1
J1-LBO2
J1-LBO3
J1-LBO4
E1-75Ω
MODE
The package is mounted on a four-layer JEDEC standard test board.
Theta-JA ( θ
test board.
Typical voltage, transmitting/receiving 50% 1s in Watts.
Typical voltage, transmitting/receiving 100% 1s in Watts.
Maximum voltage, transmitting/receiving 100% 1s in Watts.
JA
JB
JA
JA
JA
JC
INTERNAL
) in Still Air Conduction
) Conduction
) in Forced Air
) in Forced Air
) in Forced Air
) Conduction
FULLY
TYPICAL 50% 1s (Note 1)
1.64
1.49
1.87
1.92
1.95
1.99
2.02
1.84
1.89
1.92
1.95
1.99
JA
PARAMETER
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard
PARTIALLY
INTERNAL
1.43
1.19
1.52
1.57
1.60
1.63
1.67
1.49
1.54
1.57
1.60
1.63
EXTERNAL
1.31
1.19
1.47
1.51
1.55
1.58
1.61
1.47
1.51
1.55
1.58
1.61
DS26334 3.3V, 16-Channel, E1/T1/J1 Short/Long-Haul Line Interface Unit
INTERNAL
FULLY
TYPICAL 100% 1s (Note 2)
2.56
2.23
2.96
3.03
3.06
3.12
3.16
2.90
2.96
2.99
3.05
3.10
118 of 121
-40°C
MIN
PARTIALLY
INTERNAL
2.15
1.62
2.26
2.32
2.35
2.41
2.46
2.20
2.26
2.29
2.35
2.39
+16.6°C/W
+15.0°C/W
+14.6°C/W
+14.0°C/W
+3.0°C/W
+7.5°C/W
TYP
EXTERNAL
1.90
1.62
2.14
2.20
2.29
2.29
2.34
2.14
2.20
2.29
2.29
2.34
INTERNAL
+125°C
+85°C
FULLY
MAX
MAXIMUM 100% 1s (Note 3)
2.82
2.54
3.56
3.63
3.66
3.72
3.77
3.44
3.51
3.54
3.60
3.65
PARTIALLY
INTERNAL
V (m/s)
2.36
1.69
2.51
2.57
2.60
2.67
2.72
2.36
2.42
2.45
2.52
2.57
0.75
1.25
2.5
0
EXTERNAL
NOTES
1.98
1.69
2.23
2.30
2.39
2.39
2.44
2.23
2.30
2.39
2.39
2.44
1
2

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