SBT-BGA-6002 Ironwood Electronics, SBT-BGA-6002 Datasheet - Page 2

• Manufacturer Part Number: SBT-BGA-6002
• Description: Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
• Manufacturer: Ironwood Electronics

Description: Recommended PCB layout
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], all other tolerances ±0.025mm [±0.001"] unless stated otherwise. Materials and specifications are subject to change without notice.
34.7250±0.1250
A1 Corner
www.ironwoodelectronics.com
Ironwood Electronics, Inc.
Tele: [phone]
SBT-BGA-6002 Drawing
12.5000
9.7825
WEIGHT:
MATERIAL:
FINISH:
*12.1250
32.6000±0.1250
29.7250±0.0500
25
STATUS:Released
DRAWN BY: Vinayak R
File: SBT-BGA-6002 Dwg
1
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Non Plated Hole
0.5100 (x676 pad)
12.3225
0.8500
SHEET 2 OF 4
SCALE: 3:1
DATE: 11/13/2009
Non Plated Hole
1.7000±0.1000
REV. A