SBT-BGA-6002 Ironwood Electronics, SBT-BGA-6002 Datasheet - Page 4

• Manufacturer Part Number: SBT-BGA-6002
• Description: Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
• Manufacturer: Ironwood Electronics

15.6600
Description: Socket Assembly SBT-BGA Socket 27x27mm, 1mm, 26x26 array
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
32.2250
www.ironwoodelectronics.com
Ironwood Electronics, Inc.
Tele: [phone]
32.6000
SBT-BGA-6002 Drawing
WEIGHT:
MATERIAL:
FINISH:
6.3500
34.7250
Insulation Plate Specification
STATUS:Released
DRAWN BY: Vinayak R
File: SBT-BGA-6002 Dwg
20
10
1.2700
1.6100±0.0500
29.7250±0.0500
SHEET 4 OF 4
SCALE: 3:2
DATE: 11/13/2009
SBT PIN (scale 1:10)
REV. A
1.6000