SBT-BGA-6002 Ironwood Electronics, SBT-BGA-6002 Datasheet - Page 3

• Manufacturer Part Number: SBT-BGA-6002
• Description: Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
• Manufacturer: Ironwood Electronics

Description: BGA676,1mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
www.ironwoodelectronics.com
A
Ironwood Electronics, Inc.
Tele: [phone]
A1
E
SBT-BGA-6002 Drawing
SCALE 4 : 1
DETAIL G
5
0.2
D
WEIGHT:
MATERIAL:
FINISH:
0.2 Z
4
0.20
G
0.25 Z X Y
0.10
STATUS: Released
DRAWN BY: Vinayak R
File: SBT-BGA-6002 Dwg
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to
datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder
balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of
package.
e
b
DIM
A1
A
D
E
b
e
Minimum
SHEET 3 OF 4
SCALE: 2:1
DATE: 11/13/2009
0.40
0.50
26x26 array
27.0 BSC
27.0 BSC
1.00 BSC
Maximum
0.60
0.70
REV. A
2.5