D6122G NEC, D6122G Datasheet - Page 23

• Manufacturer Part Number: D6122G
• Description: Search -----> UPD6122G
• Manufacturer: NEC

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11. RECOMMENDED SOLDERING CONDITIONS
MANUAL (IEI-1207).
is done under different conditions.
Infrared ray reflow
VPS
Wave soldering
Partial heating
The following conditions (see table below) must be met when soldering this product.
For more details, refer to the NEC document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
Please consult an NEC sales representative in case an other soldering process is used, or in case soldering
Caution
PD6121G-001: 20-pin plastic SOP (375 mil)
PD6121G-002: 20-pin plastic SOP (375 mil)
PD6122G-001: 24-pin plastic SOP (375 mil)
PD6122G-002: 24-pin plastic SOP (375 mil)
Soldering Process
Do not apply more than one soldering method at any one time, except for the partial heating
method.
Table 11-1. Soldering Conditions for Surface Mounting
Peak temperature of package surface: 230 C,
Peak temperature of package surface: 215 C,
Reflow time: 30 seconds or less (210 C or higher),
Number of reflow processes: 1
Reflow time: 40 seconds or less (200 C or higher),
Number of reflow processes: 1
Solder temperature: 260 C or lower,
Reflow time: 10 seconds or less, Number of reflow processes: 1
Preheat temperature: 120 C or lower (at package surface)
Pin temperature: 300 C or lower,
Time: 3 seconds or less (per device side)
Soldering Conditions
PD6121, 6122
WS60-00-1
VP15-00-1
IR30-00-1
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