ds3171n Maxim Integrated Products, Inc., ds3171n Datasheet - Page 219
ds3171n
Manufacturer Part Number
ds3171n
Description
Ds3171, Ds3172, Ds3173, Ds3174 Single/dual/triple/quad Ds3/e3 Single-chip Transceivers
Manufacturer
Maxim Integrated Products, Inc.
Datasheet
1.DS3171N.pdf
(234 pages)
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16 PACKAGE THERMAL INFORMATION
The 36 thermal V
internal GND plane of the PC board to achieve these thermal characteristics.
Target Ambient Temperature Range
Die Junction Temperature Range
Theta-JA, Still Air
Note 1:
Theta-JA is based on the package mounted on a 4-layer JEDEC board
and measured in a JEDEC test chamber.
PARAMETER
SS
balls in the center 6X6 matrix must be thermally and electrically connected to the
12.6 °C/W (Note 1)
-40°C to +85°C
-40 to +125°C
VALUE
219
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