SSTUA32S865 NXP Semiconductors, SSTUA32S865 Datasheet - Page 2

• Manufacturer Part Number: SSTUA32S865
• Description: Sstua32s865 1.8 V 28-bit 1 2 Registered Buffer With Parity For Ddr2-667 Rdimm Applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
SSTUA32S865_2
Product data sheet
Type number
SSTUA32S865ET/G Pb-free (SnAgCu solder ball
SSTUA32S865ET
Ordering information
Solder process
compound)
SnPb solder ball compound
I
I
400 MT/s to 667 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs
DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
Rev. 02 — 16 March 2007
Package
Name
TFBGA160 plastic thin fine-pitch ball grid array package;
TFBGA160 plastic thin fine-pitch ball grid array package;
Description
160 balls; body 9
160 balls; body 9
1.8 V DDR2-667 registered buffer with parity
13
13
SSTUA32S865
0.8 mm
0.8 mm
© NXP B.V. 2007. All rights reserved.
Version
SOT802-1
SOT802-1
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