mt45w4mw16p Micron Semiconductor Products, mt45w4mw16p Datasheet - Page 32

• Manufacturer Part Number: mt45w4mw16p
• Description: Async/page Cellularramtm 1.0 Memory
• Manufacturer: Micron Semiconductor Products

Figure 24:
PDF: 09005aef80be1ee8/Source: 09005aef80be1f7f
AsyncCellularRAM_2.fm - Rev. G 10/05 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS Ø0.35.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron
SEATING PLANE
for production devices. Although considered final, these specifications are subject to change, as further product
5.25
48X Ø0.37
0.10 C
2.625 ±0.05
48-Ball VFBGA
Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
BALL A6
0.70 ±0.05
C
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Notes: 1. All dimensions in millimeters, MAX/MIN, or typical where noted.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
All other trademarks are the property of their respective owners.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
1.875
0.25mm per side.
development and data characterization sometimes occur.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
64Mb: 4 Meg x 16 Async/Page CellularRAM 1.0 Memory
0.75 TYP
C L
4.00 ±0.05
BALL A1
BALL A1 ID
32
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø0.30 SOLDER MASK DEFINED
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
©2003 Micron Technology, Inc. All rights reserved.
Timing Diagrams
BALL A1 ID