mt4jtf6464ay-1g1 Micron Semiconductor Products, mt4jtf6464ay-1g1 Datasheet
mt4jtf6464ay-1g1
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mt4jtf6464ay-1g1 Summary of contents
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... DDR3 SDRAM UDIMM MT4JTF6464AY – 512MB For component data sheets, refer to Micron’s Web site: Features • DDR3 functionality and operations supported as per component data sheet • 240-pin, unbuffered dual in-line memory module (UDIMM) • Fast data transfer rates: PC3-10600, PC3-8500, or PC3-6400 • ...
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... Notes: 1. Data sheets for the base device parts can be found on Micron’s Web site. 2. All numbers end with a two-place code (not shown), designating component and PCB revi- sions. Consult factory for current revision codes. Example: MT4JTF6464AY-1G1B1. PDF:09005aef82b2263f/Source:09005aef82b22627 JTF4C_64x64AY.fm - Rev. A 7/07 EN 512MB (x64, SR) 240-Pin DDR3 SDRAM UDIMM ...
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Pin Assignments and Descriptions Table 4: Pin Assignment 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ25 61 V REF ...
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Table 5: Pin Descriptions Symbol Type A0–A12 Input Address inputs: Provide the row address for ACTIVE commands and the column address and auto precharge bit for READ/WRITE commands to select one location out of the memory array in the respective ...
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Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0 # DQS0 DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1# DQS1 DM1 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 V SS DQS2# DQS2 DM2 DQ16 DQ17 DQ18 ...
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... General Description The MT4JTF6464AY DDR3 SDRAM module is a high-speed, CMOS, dynamic random- access 512MB memory module organized in a x64 configuration. This DDR3 SDRAM module uses an internally configured 8-bank (1Gb) DDR3 SDRAM device. DDR3 SDRAM modules use double data rate architecture to achieve high-speed opera- tion ...
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Electrical Specifications Stresses greater than those listed in Table 6, may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in the ...
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Table 8: Module and Component Speed Grades DDR3 components must be able to meet or exceed the listed speed grade. Module Speed Grade -1G4 -1G3 -1G1 -1G0 -80C -80B I Specifications DD Table 9: DDR3 I Specifications and Conditions – ...
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Serial Presence-Detect Table 10: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input ...
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Table 12: Serial Presence-Detect Matrix Byte 0 CRC coverage EEPROM device size Number of SPD bytes written 1 SPD revision 2 DRAM device type (technology) 3 Module type (form factor) 4 SDRAM device density and internal banks 5 SDRAM device ...
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Table 12: Serial Presence-Detect Matrix (continued) Byte 23 MIN active-to-active/refresh ( 24 MIN refresh recovery delay time ( 25 MIN refresh recovery delay time ( 26 MIN internal WRITE-to-READ command delay time ( 27 MIN internal READ-to-PRECHARGE command delay time ...
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Module Dimensions Figure 3: 240-Pin DDR3 UDIMM 0.75 (0.03) R (8X 2.50 (0.098) D (2X) 2.30 (0.091) TYP PIN 1 2.20 (0.087) TYP 1.45 (0.057) TYP 54.68 (2.15) TYP 3.05 (0.12) TYP PIN 240 Notes: 1. All dimensions ...