w83195bg-912 Winbond Electronics Corp America, w83195bg-912 Datasheet - Page 25

• Manufacturer Part Number: w83195bg-912
• Description: Clock For Via Chipsets
• Manufacturer: Winbond Electronics Corp America

9.3
9.4
9.5
VDD=VDDAGP=VDDC=VDDR=VDDPCI=VDD48= 3.3V
AGP to PCI Skew
CPU to CPU Skew
AGP to AGP Skew
PCI to PCI Skew
48MHz to 48MHz Skew
REF to REF Skew
VDDCPU= 3.3V
IREF=2.32mA, Ioh=6*IREF
Rise Time
Fall Time
Absolute
Voltages
Cycle to Cycle jitter
Duty Cycle
VDDCPU= 3.3V
IREF=5mA, Ioh=4*IREF
Rise Time
Fall Time
Absolute
Voltages
Cycle to Cycle jitter
Duty Cycle
Skew Group timing clock
CPU 0.7V Electrical Characteristics
CPU 1.0V Electrical Characteristics
PARAMETER
PARAMETER
PARAMETER
crossing
crossing
±
±
CLOCK GEN. FOR VIA P4/KT SERIES CHIPSET
5 %, TA = 0
5 %, TA = 0
point
point
MIN
1.5
MIN
MIN
175
175
250
175
175
510
45
45
°
°
C to +70
C to +70
TYP
2.6
MAX
MAX
700
700
550
150
700
700
760
150
55
55
°
°
C, Test load Rs=33, Rp=49.9 Cl=10pF, Vr=475,
C, Test load Rs=33, Rp=49.9 Cl=10pF, Vr=221,
1000
MAX
200
250
500
500
3.5
- 21 -
UNITS
UNITS
mV
ps
ps
ps
mV
%
ps
ps
ps
%
±
UNITS
5 %, TA = 0
ns
ps
ps
ps
ps
ps
100 to 200 Mhz
100 to 200Mhz
100 to 200Mhz
100 to 200Mhz
100 to 200Mhz
100 to 200 Mhz
100 to 200Mhz
100 to 200Mhz
100 to 200Mhz
100 to 200Mhz
Measured at 1.5V
Crossing point
Measured at 1.5V
Measured at 1.5V
Measured at 1.5V
Measured at 1.5V
Publication Release Date: Mar. 2006
TEST CONDITIONS
°
TEST CONDITIONS
C to +70
W83195BG-912
TEST CONDITIONS
°
C, Cl=10pF
Revision 0.6