pcf8535 NXP Semiconductors, pcf8535 Datasheet - Page 48
pcf8535
Manufacturer Part Number
pcf8535
Description
65 X 133 Pixel Matrix Driver
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8535.pdf
(56 pages)
Philips Semiconductors
2001 Nov 07
handbook, full pagewidth
65
The position of the bonding pads is not to scale.
133 pixel matrix driver
Dummy bump
Alignment mark
Fig.33 Bonding pad location (viewed from bump side).
V LCDSENSE
V LCDOUT
PAD ONE
V LCDIN
SDAOUT
V DD2
V DD3
V DD1
V SS2
V SS1
SDA
SCL
OSC
RES
SA1
SA0
R48
R64
R32
R16
. .
.
. .
.
. .
.
. .
.
T3
T2
T1
T5
T4
(0,0)
48
y
x
MGS693
R33
R47
C132
C0
R15
R0
. .
.
. .
.
. .
.
. .
.
. .
.
. .
.
Product specification
PCF8535
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