tda8034at NXP Semiconductors, tda8034at Datasheet
tda8034at
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tda8034at Summary of contents
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... Rev. 01 — 5 February 2010 1. General description The TDA8034T/TDA8034AT is a cost-effective analog interface for asynchronous and synchronous smart cards operating Using few external components, the TDA8034T/TDA8034AT provides all supply, protection and control functions between a smart card and the microcontroller. 2. Features I ...
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... C to +85 C amb should be decoupled to pin GND using two ceramic multilayer capacitors of low ESR with values of Description plastic small outline package; 16 leads; body width 3.9 mm Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface = 25 ˚C; unless otherwise specified. amb Min Typ 4 ...
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... ALARMN EN1 PVCC SEQUENCER EN4 EN3 EN2 CLK CLOCK CIRCUITRY THERMAL PROTECTION TDA8034T CRYSTAL OSCILLATOR TDA8034AT 1 2 XTAL2 Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface 10 F 100 nF V DDP LDO CC 11 RST RESET GENERATOR 10 CLK CLOCK GENERATOR ...
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... I = input output, I/O = input/output ground and P = power supply. [2] If pin PRESN is HIGH, the card is considered to be present. During card insertion, debouncing can occur on these signals. To counter this, the TDA8034T/TDA8034AT has a built-in debouncing timer (typically 4.5 ms). [3] Uses an internal 11 k pull-up resistor connected to pin V ...
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... V for a maximum load current DDP V DD(INTF DDP Voltage supervisor circuit Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface DD(INTF) falls below the falling threshold voltage ( only used during the activation sequences. of 4.75 V and that the REFERENCE VOLTAGE 001aak991 ...
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... Power-On Reset (POR) and supply drop-out detection during a card session. The supervisor threshold voltages for V than V th has reached a level higher than V The output of the supervisor is sent to a digital controller in order to reset the TDA8034T/TDA8034AT. This defined reset pulse of approximately 8 ms, i. fosc(int)low voltage power on; see V falls below V ...
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... The active pull-up feature ensures fast LOW-to-HIGH transitions making the TDA8034T/TDA8034AT capable of delivering more than 1 mA output voltage of 0. load of 80 pF. At the end of the active pull-up pulse, the output voltage is CC dependent on the internal pull-up resistor value and load current ...
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... NXP Semiconductors 8.5 Shutdown mode After a power-on reset, if pin CMDVCCN is HIGH, the circuit enters the Shutdown mode, ensuring only the minimum number of circuits are active while the TDA8034T/TDA8034AT waits for the microcontroller to start a session. • all card contacts are inactive. The impedance between the contacts and GND is approximately 200 . • ...
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... OSCINT Fig 6. 8.7 Deactivation sequence When a session ends, the microcontroller sets pin CMDVCCN HIGH. The TDA8034T/TDA8034AT then executes an automatic deactivation sequence by counting the sequencer back to the inactive state (see 1. Pin RST is pulled LOW (t11). 2. The clock is stopped, pin CLK is LOW (t12). 3. Pin I/O is pulled LOW (t13). ...
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... OSCINT = internal oscillator. Deactivation sequence buffer is able to continuously deliver buffer has an internal overload protection with a threshold value of approximately falling falling falling Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface low frequency t13 t14 = 001aak995 Table 8 ...
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... On card insertion or removal, bouncing can occur in the PRESN signal. This depends on the type of card presence switch in the connector (normally open or normally closed) and the mechanical characteristics of the switch. To correct for this, a debouncing feature is integrated in to the TDA8034T/TDA8034AT. This feature operates at a typical duration of 4 debouncing feature. ...
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... If pin CMDVCCN is HIGH for more than 15 ms (t0 > 15 ms) but less than 30 ms, pin CMDVCCN must be set LOW for t1 (200 s < t1 < 700 s), and then HIGH for t2 (200 s < t2 < 15 ms) before going LOW. TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT t deb (1) ) that the card requires is determined automatically by monitoring CC set ...
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... V electrostatic discharge voltage ESD 10. Thermal characteristics Table 6. Thermal characteristics Symbol Package name Parameter R SO16 thermal resistance from junction to ambient th(j-a) TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT CMDVCCN > Figure 12 Table 5 Conditions pin V DDP pin V DD pin V ...
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... I < 200 mA < 400 ns 20 kHz to 200 MHz shorted to ground card 3 V card Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface = 25 C; unless otherwise specified. amb Min Typ Max 4.85 5 5.5 2.7 3.3 3.6 1.6 3.3 ...
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... V maximum minimum pF maximum minimum pF Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface = 25 C; unless otherwise specified. amb Min Typ Max - - 0.3 - +0.3V 0.3 - +0.3V 0.7V - ...
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... 200 current limit 200 A OH current limit 100 pF L Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface = 25 C; unless otherwise specified. amb Min Typ Max 0.3 0. DD(INTF) 0.75V - ...
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... V CC [6] control input = DD(INTF) control input = DD(INTF card; Figure card; Figure 11, Figure 12 Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface = 25 C; unless otherwise specified. amb Min Typ Max - - 0.3 V 0.4 - ...
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... Figure 7 on page 10 CLK sent to card using an external clock t = t3; see Figure 6 on page 9 d(start t5; see Figure 6 on page 9 d(end) pin PRESN Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface = 25 C; unless otherwise specified. amb Min Typ Max 0. DD(INTF) - ...
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... NXP Semiconductors Fig 13. Definition of output and input transition times 12. Application information V DD(INTF) Fig 14. Application diagram TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT MICROCONTROLLER TDA8034T TDA8034AT XTAL1 DD(INTF) XTAL2 DD(INTF RSTIN 100 ...
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... 0.49 0.25 10.0 4.0 1.27 0.36 0.19 9.8 3.8 0.019 0.0100 0.39 0.16 0.244 0.05 0.014 0.0075 0.38 0.15 0.228 REFERENCES JEDEC JEITA MS-012 Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface detail 6.2 1.0 0.7 1.05 0.25 0.25 5.8 0.4 0.6 0.039 0.028 ...
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... Solder bath specifications, including temperature and impurities TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT Rev. 01 — 5 February 2010 Smart card interface © NXP B.V. 2010. All rights reserved ...
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... Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT and 11 SnPb eutectic process (from J-STD-020C) Package reflow temperature ( C) 3 Volume (mm ) < ...
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... ElectroStatic Discharge Equivalent Series Resistor Field Charged Device Model Human Body Model Low Drop-Out Machine Model Negative-channel Metal-Oxide Semiconductor Power-On Reset Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface peak temperature time 001aac844 © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors 16. Revision history Table 13. Revision history Document ID Release date TDA8034T_TDA8034AT_1 20100205 TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT Data sheet status Change notice Product data sheet - Rev. 01 — 5 February 2010 Smart card interface Supersedes - © NXP B.V. 2010. All rights reserved ...
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... TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...
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... For sales office addresses, please send an email to: TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. ...
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... Protection characteristics . . . . . . . . . . . . . . . . .18 Table 9. Timing characteristics . . . . . . . . . . . . . . . . . . .18 Table 10. SnPb eutectic process (from J-STD-020C .22 Table 11. Lead-free process (from J-STD-020C .22 Table 12. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .23 Table 13. Revision history . . . . . . . . . . . . . . . . . . . . . . . .24 TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT Rev. 01 — 5 February 2010 Smart card interface © NXP B.V. 2010. All rights reserved ...
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... Fig 13. Definition of output and input transition times . . .19 Fig 14. Application diagram . . . . . . . . . . . . . . . . . . . . . . .19 Fig 15. Package outline SOT109-1 (SO16 .20 Fig 16. Temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 TDA8034T_TDA8034AT_1 Product data sheet . . . . . . . . . . . . . . .12 CC Rev. 01 — 5 February 2010 TDA8034T; TDA8034AT Smart card interface © NXP B.V. 2010. All rights reserved ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: TDA8034T_TDA8034AT_1 Smart card interface All rights reserved. Date of release: 5 February 2010 ...