tda8035hn NXP Semiconductors, tda8035hn Datasheet
tda8035hn
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tda8035hn Summary of contents
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... TDA8035HN Smart card interface Rev. 1.0 — 19 April 2011 1. General description The TDA8035 is the cost efficient successor of the well established integrated contact smart card reader IC TDA8024. It offers a high level of security for the card performing current limitation, short circuit detection, ESD protection as well as supply supervision. ...
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... V; Icc = XTAL Deep Shutdown mode stopped; XTAL present card Shutdown mode stopped; XTAL present card All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface ° C; unless otherwise specified Min Typ 2.7 3.3 1.6 3.3 - 0.1 - 300 = + ...
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... T amb Description plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 × 5 × 0.85 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface ° C; unless otherwise specified Min Typ < 4.75 5 ...
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... INTERNAL OSCILLATOR THERMAL configurations PROTECTION bus for smartcard reader interface DIGITAL interuption SEQUENCER All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface 330 nF 330 nF 10 μF 100 nF GNDP SAP SAM SBP SBM DCDC CONVERTER ...
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... Internal supply voltage I/O DC/DC converter capacitor ; connected between SAM and SAP 330nF with ESR < 100mΩ supply DC/DC converter power supply ground All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface 24 CLK 23 RST 22 VCC 21 VUP ...
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... V ) DD(INTF) I/O auxiliary data line to/from the host (internal 10 k pull up resistor DD(INTF) All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface Vcc ) © NXP B.V. 2011. All rights reserved ...
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... Product data sheet should be in the range from 2.7 to 5.5 V DDP DDP Figure All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface . All card DD(INTF) is below the threshold voltage falling. 3): © NXP B.V. 2011. All rights reserved. ...
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... REG REG supervisors are combined and sent to a digital controller in order to reset the falls below Vthextf or when V DDP All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN vbg vreg vbg vbg 001aan747 using the PORADJ pin. DD(INTF) ...
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... Vddp 2.65 V 2.5 V Vth_vddp_hI 1 Vreg 1.8 V Vsup 2 Supalarm 3 100 μs analog delay Reset Voltage supervisor All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface 180 kHz 1.2 V debouncing Vth_Vddp_Ih Start debouncing if a card ...
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... XTAL XTAL/2, XTAL/4 Clock configuration CLKDIV2 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface clkxtal MUX XTAL 001aan750 , via the pins CLKDIV1 and XTAL/2 XTAL/4 XTAL XTAL/8 ...
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... CC . DD(INTF) , the logic 0 present on the master side is transmitted to the slave d(edge) All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface . , thus allowing operation with DD(INTF load. At the end of the active CC © NXP B.V. 2011. All rights reserved. ...
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... Shutdown Mode Activation OFFN PRESN VCC Shutdown mode and Deep Shutdown mode All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface Shutdown Deep Shutdown debounce Figure 8 Activation 001aan751 © NXP B.V. 2011. All rights reserved. ...
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... VCC IO CLK RST ≈ Activation sequence at t3 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface Figure = t + 10T) (They were pulled LOW until this with 200 ns < x < 1/fXtal 4 ...
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... VUP Xtal1 Oscint high frequency t10 t11 t12 t13 t14 Deactivation sequence All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface Figure 9 low frequency t15 © NXP B.V. 2011. All rights reserved ...
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... When the card is inserted, OFFN goes High only at the end of the All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface 16): is detected DDP © NXP B.V. 2011. All rights reserved. ...
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... OFFN tdeb VCC Deactivation caused by cards withdrawal All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface low frequency t15 001aan754 tdeb Deactivation caused by short circuit 001aan757 © NXP B.V. 2011. All rights reserved. ...
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... Field Charged Device Model (FCDM) on all pins Conditions in free air with 4 thermal vias on pcb in free air without thermal vias on pcb All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface Min Max Unit −0 −0.3 4 ...
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... Exit of deep Shutdown mode < < 1 < All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface C; unless otherwise specified Min Typ 2.7 3.3 1.6 3.3 - 0.1 - 300 / ...
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... V card 3 V card 1.8 V card connected on pins XTAL1/XTAL2 (depending on specification of crystal or resonator used) with 56 pF serial capacitor All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface ° C; unless otherwise specified Min Typ 396 - −0.1 - − ...
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... V min < from connected 0 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface ° C; unless otherwise specified Min Typ - - - - - - - - 200 - - - - CC ...
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... and + 100 + inactive mode; no load inactive mode All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface ° C; unless otherwise specified Min Typ 0 DD(INTF) 0. DD(INTF) 0. DD(INTF) − ...
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... V on control input DD(INTF DD(INTF −15 μA OH All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface ° C; unless otherwise specified Min Typ - - 0 - − ...
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... CGND using two ceramic multilayer capacitors of low ESR with values of Figure 12 on page t r 90% 90% 10% 10 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface ° C; unless otherwise specified Min Typ - 150 −15 - −70 - − ...
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... TDA8035 C10 C2 100 nF ( All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface CARD C8 CONNECTOR C5 C1 CLK RST VCC 0 Ω C5 VUP 1 μF (2) SAP ...
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... 5.1 2.2 5.1 2.2 5.0 2.1 5.0 2.1 0.5 3.5 3.5 4.9 2.0 4.9 2.0 References JEDEC JEITA - - - - - - All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface detail 0.5 0.4 0.1 0.05 0.05 0.1 0.3 European projection SOT617-7 c sot617-7_po ...
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... The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. TDA8035HN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface © NXP B.V. 2011. All rights reserved ...
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... Product data sheet Suitability of surface mount IC packages for wave and reflow soldering methods , SO, SOJ Abbreviations Description ElectroStatic Discharge All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface Soldering method Wave Reflow not suitable suitable [2] ...
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... NXP Semiconductors 16. Revision history Table 10. Revision history Document ID Release date TDA8035HN v. 1.0 20110419 TDA8035HN Product data sheet Data sheet status Change notice Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface Supersedes - © ...
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... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface © NXP B.V. 2011. All rights reserved ...
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... Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface © NXP B.V. 2011. All rights reserved ...
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... Characteristics Table 8. Suitability of surface mount IC packages for wave and reflow soldering methods . . . . . . 27 Table 9. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 10. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 19 April 2011 TDA8035HN Smart card interface © NXP B.V. 2011. All rights reserved ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Smart card interface All rights reserved. Date of release: 19 April 2011 Document identifier: TDA8035HN ...