tda9884 NXP Semiconductors, tda9884 Datasheet - Page 54

• Manufacturer Part Number: tda9884
• Description: Tda9884 I2c-bus Controlled Multistandard Alignment-free If-pll For Mobile Reception
• Manufacturer: NXP Semiconductors

Philips Semiconductors
TDA9884_2
Product data sheet
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These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 02 — 12 May 2006
I
2
C-bus controlled multistandard alignment-free IF-PLL
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
TDA9884
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