ep1sgx25d Altera Corporation, ep1sgx25d Datasheet - Page 186

• Manufacturer Part Number: ep1sgx25d
• Description: Stratix Gx Device Family Data Sheet
• Manufacturer: Altera Corporation

I/O Structure
4–120
Stratix GX Device Handbook, Volume 1
Notes to
(1)
(2)
(3)
R
Table 4–31. Differential On-Chip Termination
Symbol
D
(2)
Data measured over minimum conditions (T
V
Data measured over minimum conditions (T
V
LVDS data rate is supported for 840 Mbps using internal differential termination.
CCIO
CCIO
Table
= –5%).
= –5%).
Internal differential termination for LVDS
4–31:
Description
However, there is additional resistance present between the device ball
and the input of the receiver buffer, as shown in
resistance is because of package trace resistance (which can be calculated
as the resistance from the package ball to the pad) and the parasitic layout
metal routing resistance (which is shown between the pad and the
intersection of the on-chip termination and input buffer).
Figure 4–71. Differential Resistance of LVDS Differential Pin Pair (R
Table 4–31
commercial devices.
MultiVolt I/O Interface
The Stratix GX architecture supports the MultiVolt I/O interface feature,
which allows Stratix GX devices in all packages to interface with systems
of different supply voltages.
The Stratix GX VCCINT pins must always be connected to a 1.5-V power
supply. With a 1.5-V V
3.3-V tolerant. The VCCIO pins can be connected to either a 1.5-V, 1.8-V,
defines the specification for internal termination resistance for
Package Ball
Package Ball
R
D
j
j
= –40 C, V
= 0 C, V
0.3 Ω
0.3 Ω
CCINT
C C I O
CCIO
Pad
Pad
Commercial (1),
Industrial (2),
+5%) and maximum conditions (T
+5%) and maximum conditions (T
level, input pins are 1.5-V, 1.8-V, 2.5-V, and
9.3 Ω
9.3 Ω
Conditions
(3)
(3)
Input Buffer
LVDS
Differential On-Chip
Termination Resistor
Figure
Min
110
100
Resistance
Altera Corporation
4–71. This
j
135
135
Typ
= 85 C,
j
= 100 C,
February 2005
Max
165
170
D
)
Unit
Ω
Ω