xc2vp2 Xilinx Corp., xc2vp2 Datasheet - Page 290

• Manufacturer Part Number: xc2vp2
• Description: Virtex-ii Pro And Virtex-ii Pro X Platform Fpgas
• Manufacturer: Xilinx Corp.

FF1517 Flip-Chip Fine-Pitch BGA Package
As shown in
package. Following this table are the
Table 12: FF1517 — XC2VP50 and XC2VP70
DS083 (v4.7) November 5, 2007
Product Specification
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
Table
12, XC2VP50 and XC2VP70 Virtex-II Pro devices are available in the FF1517 flip-chip fine-pitch BGA
IO_L03P_0/VREF_0
IO_L09P_0/VREF_0
IO_L27P_0/VREF_0
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L05_0/No_Pair
Pin Description
IO_L02N_0
IO_L03N_0
IO_L06N_0
IO_L07N_0
IO_L08N_0
IO_L09N_0
IO_L19N_0
IO_L20N_0
IO_L21N_0
IO_L25N_0
IO_L26N_0
IO_L27N_0
IO_L28N_0
IO_L29N_0
IO_L30N_0
IO_L34N_0
IO_L02P_0
IO_L06P_0
IO_L07P_0
IO_L08P_0
IO_L19P_0
IO_L20P_0
IO_L21P_0
IO_L25P_0
IO_L26P_0
IO_L28P_0
IO_L29P_0
IO_L30P_0
FF1517 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
www.xilinx.com
Number
M27
M26
Pin
D31
G30
H30
C30
D30
G29
H29
C29
D29
H28
D28
E31
K30
K28
E30
F30
K29
E29
F29
L28
L27
E28
J30
J29
J28
H27
G27
D27
K26
F28
J27
J26
XC2VP50
NC
NC
NC
NC
NC
NC
NC
No Connects
pitch).
XC2VP70
Module 4 of 4
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