mpc8260aec Freescale Semiconductor, Inc, mpc8260aec Datasheet - Page 11

• Manufacturer Part Number: mpc8260aec
• Description: Mpc826xa Hip4 Family Hardware
• Manufacturer: Freescale Semiconductor, Inc

1.2.2
Table 4 describes thermal characteristics.
1.2.3
The average chip-junction temperature
where
For most applications P
is the following:
Solving equations (1) and (2) for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
P
equations (1) and (2) iteratively for any value of T
MOTOROLA
D
1
2
3
4
5
(at equilibrium) for a known T
Junction to ambient
Junction to board
Junction to case
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
Assumes a single layer board with no thermal vias
Natural convection
Assumes a four layer board
is measured on the top surface of the board near the package.
SPEC-883 Method 1012.1).
T
T
θ
P
P
P
P
K = P
A
JA
D
INT
I/O
D
J
= T
= ambient temperature °C
= P
= K/(T
= package thermal resistance
Thermal Characteristics
Power Considerations
= power dissipation on input and output pins (determined by user)
Characteristics
= I
D
A
INT
DD
x (T
+ (P
5
J
+ P
4
x V
+ 273° C)
A
D
+ 273° C) +
I/O
x
DD
I/O
Table 4. Thermal Characteristics for 480 TBGA Package
θ
JA
Watts (chip internal power)
MPC826xA (HiP4) Family Hardware Specifications
< 0.3 x P
)
A
. Using this value of K
θ
INT
JA
,
. If P
x P
T
,
J ,
junction to ambient
D
in °C can be obtained from the following:
Symbol
I/O
2
θ
θ
θ
JC
JA
JB
is neglected
A
.
,
the values of P
,
an approximate relationship between P
Value
,
13
10
11
1.1
°C/W
8
4
3
1
1
3
Electrical and Thermal Characteristics
D
and T
°C/W
°C/W
°C/W
Unit
J
can be obtained by solving
Air Flow
1 m/s
1 m/s
NC
NC
—
—
2
D
and T
(2)
(1)
(3)
11
J