mpc8260aec Freescale Semiconductor, Inc, mpc8260aec Datasheet - Page 44

no-image

mpc8260aec

Manufacturer Part Number
mpc8260aec
Description
Mpc826xa Hip4 Family Hardware
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.5.2
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
44
Mechanical Dimensions
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
MPC826xA (HiP4) Family Hardware Specifications
Notes:
1. Dimensions and Tolerancing per
2. Dimensions in millimeters.
3. Dimension b is measured at the
4. Primary data A and the seating
ASME Y14.5M-1994.
maximum solder ball diameter,
parallel to primary data A.
plane are defined by the spherical
crowns of the solder balls.
Dim
A1
A2
A3
D1
E1
A
D
E
b
e
1.45
0.60
0.85
0.25
0.65
Min
Millimeters
37.50 BSC
37.50 BSC
35.56 REF
35.56 REF
1.27 BSC
MOTOROLA
Max
1.65
0.70
0.95
0.85

Related parts for mpc8260aec