mpc8260aec Freescale Semiconductor, Inc, mpc8260aec Datasheet - Page 30

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mpc8260aec

Manufacturer Part Number
mpc8260aec
Description
Mpc826xa Hip4 Family Hardware
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
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Figure 13. Pinout of the 480 TBGA Package as Viewed from the Top Surface
Soldermask
1.27 mm Pitch
Polymide Tape
MPC826xA (HiP4) Family Hardware Specifications
(Oxidized for Insulation)
Copper Heat Spreader
Figure 14. Side View of the TBGA Package
Glob-Top Dam
Glob-Top Filled Area
View
Die
Attach
Die
Copper Traces
Cavity
Etched
Pressure Sensitive
Adhesive
MOTOROLA
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