mpc5553 Freescale Semiconductor, Inc, mpc5553 Datasheet - Page 6

• Manufacturer Part Number: mpc5553
• Description: Mpc5553 High Performance Microcontroller
• Manufacturer: Freescale Semiconductor, Inc

Electrical Characteristics
3.2
The shaded rows in the following table indicate information specific to a four-layer device.
3.2.1
An estimation of the device junction temperature, T
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
1
2
3
4
5
6
6
Spec
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
1
2
3
4
5
6
7
Junction to ambient
Junction to ambient
(four-layer board 2s2p)
Junction to ambient (@200 ft./min., one-layer board)
Junction to ambient (@200 ft./min., four-layer board 2s2p)
Junction to board
Junction to case
Junction to package top
Thermal Characteristics
where:
General Notes for Specifications at Maximum Junction Temperature
T
T
R
P
A
D
J
θJA
= T
= ambient temperature for the package (
= power dissipation in the package (W)
= junction to ambient thermal resistance (
MPC5553 Thermal Characteristic
A
5
+ (R
4
(four-layer board 2s2p)
1, 2
1, 3
, natural convection (one-layer board)
θJA
, natural convection
6
, natural convection
× P
MPC5553 Microcontroller Data Sheet, Rev. 2.0
D
)
Table 3. Thermal Characteristics
J
, can be obtained from the equation:
o
C)
o
C/W)
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
MAPBGA
208
41
25
33
22
15
7
2
Package
PBGA
324
30
21
24
17
12
Freescale Semiconductor
8
2
PBGA
416
29
21
23
18
13
9
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit