tda1575t-v2 NXP Semiconductors, tda1575t-v2 Datasheet - Page 12

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tda1575t-v2

Manufacturer Part Number
tda1575t-v2
Description
Fm Front End Circuit For Cenelec En 55020 Applications
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
PACKAGE OUTLINE
April 1993
SO16: plastic small outline package; 16 leads; body width 3.9 mm
FM front end circuit for
CENELEC EN 55020 applications
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT109-1
0.069
max.
1.75
A
16
1
0.010
0.004
Z
0.25
0.10
pin 1 index
A
1
y
0.057
0.049
1.45
1.25
A
076E07S
2
IEC
0.25
0.01
A
3
e
0.019
0.014
0.49
0.36
b
p
D
MS-012AC
0.0100
0.0075
0.25
0.19
JEDEC
c
REFERENCES
10.0
0.39
0.38
D
9.8
0
(1)
0.16
0.15
E
4.0
3.8
(1)
b
scale
p
0.050
EIAJ
2.5
1.27
12
9
8
e
w
0.244
0.228
H
6.2
5.8
c
M
E
5 mm
0.041
A
1.05
2
L
A
1
0.039
0.016
1.0
0.4
L
p
0.028
0.020
H
0.7
0.6
E
Q
E
detail X
PROJECTION
EUROPEAN
0.25
0.01
L
v
L
p
Q
0.25
0.01
(A )
Preliminary specification
w
3
A
0.004
TDA1575T
0.1
y
A
X
v
ISSUE DATE
95-01-23
97-05-22
M
0.028
0.012
Z
0.7
0.3
(1)
A
SOT109-1
8
0
o
o

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