hsdl-3220 Avago Technologies, hsdl-3220 Datasheet
hsdl-3220
Related parts for hsdl-3220
hsdl-3220 Summary of contents
Page 1
... IOV (7) CC HSDL-3220 SD (5) RXD (4) TXD (3) LED C (2) TRANSMITTER R1 LED A (1) V led CX3 Figure 1. Functional block diagram of HSDL-3220 Figure 2. Rear view diagram with pinout. Agilent HSDL-3220 IrDA Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver Data Sheet The HSDL-3220 can be shutdown completely to achieve very low power consumption ...
Page 2
... Connect to system ground via a low inductance trace. For best performance, do not connect directly to the transceiver pin GND. 10. CX1 must be placed within 0 the HSDL-3220 to obtain optimum noise immunity. 11. In environments with noisy power supplies, including CX2, as shown in Figure 1, can enhance supply ripple rejection performance. ...
Page 3
Bandwidth Selection Timing The transceiver is in default SIR/ MIR mode when powered on. User needs to apply the following programming sequence to both the SD and TXD inputs to enable the transceiver to operate at FIR mode. SD/MODE 50% ...
Page 4
CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or ...
Page 5
Electrical and Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to 3.0V and ...
Page 6
V OH 90% 50% 10 Figure 5. RxD output waveform. TXD LED t pw (MAX.) Figure 7. TxD “Stuck On” protection waveform. 120 100 0.10 0.15 0.20 0.25 0.30 ...
Page 7
... HSDL-3220 Package Dimensions 2.0 0.8 0.4 7 ...
Page 8
... HSDL-3220 Tape and Reel Dimensions Unit: mm Ø1.5 POLARITY Pin 8: VLED Pin 1: GND 8.4 ± 0.1 0.4 ± 0.05 3.4 ± 0.1 2.8 ± 0.1 Empty Parts Mounted (40 mm min) LABEL Note: The carrier tape is compliant to the packaging materials standards for ESD sensitive device, EIA-541 8 4.0 ± 0.1 1.5 ± 0.1 +0.1 0 8.0 ± 0.1 Progressive Direction ...
Page 9
... Moisture Proof Packaging All HSDL-3220 options are shipped in moisture proof package. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN NO BAKING YES OPENED LESS IS NECESSARY THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS Figure 11 ...
Page 10
... The cool down rate, R5, from the liquidus point of the solder to 25° C (77° F) should not exceed 6° C per second maximum. This limitation is necessary to allow the PC board and HSDL-3220 castellations to change dimensions evenly, putting minimal stresses on the HSDL-3220 transceiver. ...
Page 11
Appendix A: SMT Assembly Application Note Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 12. Stencil and PCBA. Recommended Land Pattern C L 1.35 MOUNTING CENTER 0.10 1.75 0.60 0.475 1.425 UNIT: mm Figure 13. Stencil ...
Page 12
Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no ...
Page 13
Appendix B: PCB Layout Suggestion The following PCB layout guide- lines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part, ...
Page 14
... Appendix C: General Application Guide for the HSDL-3220 Description The HSDL-3220, a low-cost and small form factor infrared trans- ceiver, is designed to address the mobile computing market such as PDAs, as well as small-embedded mobile products such as digital cameras and cellular phones fully compliant to IrDA 1.4 low power specification from 9 ...
Page 15
... ROM application PCMCIA Controller RS232C Driver Figure 18. PDA platform. The link distance testing was done using typical HSDL-3220 units with SMC’s FDC37C669 and FDC37N769 Super I/O controllers link distance was demonstrated for SIR and FIR speeds. 15 HSDL-3220 Touch ...
Page 16
... Appendix D: Window Designs for HSDL-3220 Optical port dimensions for HSDL-3220 To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maxi- mum dimensions minimize the effects of stray light ...
Page 17
Module Depth Aperture Width (x, mm) (z) mm Max. 0 8.76 1 9.92 2 11.07 3 12.22 4 13.38 5 14.53 6 15.69 7 16.84 8 18.00 9 19.15 APERTURE WIDTH (X) vs. MODULE DEPTH ...
Page 18
Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make it ...
Page 19
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 ...