hsdl-3220 Avago Technologies, hsdl-3220 Datasheet - Page 12

• Manufacturer Part Number: hsdl-3220
• Description: Compliant Low Power 4.0 Mbit/s Infrared Transceiver - Agilent Hewlett-packard
• Manufacturer: Avago Technologies

12
Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is 0.2 mm.
It is recommended that two
fiducial crosses be place at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 14. Solder stencil aperature.
Stencil thickness, t (mm)
0.152 mm
0.127 mm
Figure 15. Adjacent land keepout and solder mask areas.
l
APERTURES AS PER
LAND DIMENSIONS
SOLDER MASK
0.2
10.1
length, l
2.60 ± 0.05
3.00 ± 0.05
Aperture size (mm)
w
UNITS: mm
width, w
0.55 ± 0.05
0.55 ± 0.05
t
3.85
3.0