tda5051at-c1 NXP Semiconductors, tda5051at-c1 Datasheet - Page 23
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
tda5051at-c1
Manufacturer Part Number
tda5051at-c1
Description
Home Automation Modem
Manufacturer
NXP Semiconductors
Datasheet
1.TDA5051AT-C1.pdf
(28 pages)
- Current page: 23 of 28
- Download datasheet (163Kb)
Philips Semiconductors
PACKAGE OUTLINE
1999 May 31
SO16: plastic small outline package; 16 leads; body width 7.5 mm
Home automation modem
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT162-1
max.
0.10
2.65
A
16
0.012
0.004
0.30
0.10
1
A
Z
1
y
pin 1 index
0.096
0.089
2.45
2.25
A
2
075E03
IEC
e
0.25
0.01
A
3
D
0.019
0.014
0.49
0.36
b
p
MS-013AA
0.013
0.009
0.32
0.23
JEDEC
b
c
p
0
REFERENCES
10.5
10.1
0.41
0.40
D
9
8
(1)
w
M
0.30
0.29
E
7.6
7.4
(1)
scale
0.050
EIAJ
1.27
c
23
5
e
0.419
0.394
10.65
10.00
A
H
2
E
A
1
0.055
1.4
L
10 mm
0.043
0.016
1.1
0.4
L
H
E
p
E
detail X
0.043
0.039
1.1
1.0
Q
L
L
p
Q
PROJECTION
EUROPEAN
0.25
0.01
(A )
v
3
A
0.25
0.01
w
A
Product specification
X
0.004
TDA5051A
v
0.1
y
M
ISSUE DATE
A
95-01-24
97-05-22
0.035
0.016
Z
0.9
0.4
(1)
SOT162-1
8
0
o
o
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