uzz9000 NXP Semiconductors, uzz9000 Datasheet - Page 11

• Manufacturer Part Number: uzz9000
• Description: Sensor Conditioning Electronics
• Manufacturer: NXP Semiconductors

Philips Semiconductors
PACKAGE OUTLINE
2000 Nov 27
SO24: plastic small outline package; 24 leads; body width 7.5 mm
Sensor Conditioning Electronic
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT137-1
24
max.
1
2.65
0.10
Z
A
y
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E05
IEC
0.25
0.01
A
e
3
D
0.019
0.014
0.49
0.36
b
p
0.013
0.009
0.32
0.23
MS-013
JEDEC
c
0
REFERENCES
15.6
15.2
0.61
0.60
D
(1)
b
p
0.30
0.29
E
7.6
7.4
(1)
13
12
w
scale
0.050
EIAJ
1.27
11
5
e
M
10.65
10.00
0.419
0.394
H
c
E
0.055
1.4
A
L
2
10 mm
A
1
0.043
0.016
1.1
0.4
L
p
0.043
0.039
1.1
1.0
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.25
0.01
v
L
L
p
Q
0.25
0.01
w
(A )
3
Product specification
0.004
A
0.1
y
UZZ9000
A
ISSUE DATE
99-12-27
97-05-22
0.035
0.016
X
Z
0.9
0.4
v
(1)
SOT137-1
M
A
8
0
o
o